http://www.anandtech.com/show/6465/nintendo-wii-u-teardown
几个重要部分：
There are four 4Gb (512MB) Hynix DDR3-1600 devices surrounding the Wii U's MCM (Multi Chip Module). Memory is shared between the CPU and GPU, and if I'm decoding the DRAM part numbers correctly it looks like these are 16-bit devices giving the Wii U a total of 12.8GB/s of peak memory bandwidth.

There are actually three components on this single package, made in at least two different microprocessor fabs. The multicore PowerPC based CPU is the smaller of the two larger chips. This die is made on IBM's 45nm SOI process. The RV7xx derived GPU is the biggest die on the package, and I'm presuming it was made on a 40nm process. I'm assuming the very tiny die in the corner is actually some off-chip memory. Both the CPU and GPU in the Wii U are supposed to have some eDRAM, although the bulk of it is likely dedicated for the GPU.


倒是很省电。。

基于老版本Webkit的浏览器似乎很慢。。。

完。

XO的SunSpider测试结果，5626：WiiU大幅超越那台挫机，可喜可贺。:D :D :D :D

[ 本帖最后由 宝塔震河妖 于 2012-11-19 12:27 编辑 ]