[新闻] AMD 踢爆三红秘密（AMD详解GPU封装缺陷问题起源）

techreport下面的回复有很多不同意见阿。不论怎么说，lead-free的确是大势所趋。

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Just adding to this. AMD's CPU division uses High-Pb solder themselves. Did Neil comments on this?
This GPU failure thing is getting uglier by the day. I suspect Nvidia is withholding information so they can prepare to sue their subcons.
AMD (Neil) is making these comment at this stage to prevent the fire from burning to their yard. Other than the eutectic versus Hi-Pb issue, everyone in the industry uses the same or very similar Bill of Materials (everyone who use TSMC, UMC, SPIL and ASE)!
The NV gpu failures are not materials related, they are design (IC and thermal) related.
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I have read the internal reports at Nvidia. The failures are pin specific to the pcix bus and it is mostly chipset related (c51).
Pin specific failures cannot bedue to packaging material. Failures due to packaging material should berandom pins near the corners of the die.
Let's see when Nvidia will come clean.
Ifyou want to do your own research on Hi-Pb versus eutectic Sn-Pb solder bump reliability, go to IEEE database or your local university libraryand look up "High Lead", "Eutectic", "ElectroMigration", "Finite Element", "Thermo Fatigue". Read these articles yourself.

Highlead solder has 50 years of history from the IBM days. Niel Mclellan ISa hack. He stole credits from his engineers on numerous patents that he holds.
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Most likely - similar to the Samsung VRAM BGA issue
http://www.google.com/search?hl=en&q=samsung+bga+failures&aq=f&oq=s...
The repair tech working on my personal laptop (for 3 months...) reports that the packaging is simply too thin and can't handle the long term thermal dynamics of the circuit while in operation. Sounds like nVidia may have gone down the same road.
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开始质疑Niel Mclellan的人品了~
Niel Mclellan used to be my boss in my previous company. He's a hack and doesn't know what he's talking about; he relies on engineers below him to tell him what to say. I have not seen a single engineering observation from this guy the three years I've been working for him. How he got to where he is? God knows?
If you actually read academic studies and participate in engineering, you would know that high-lead solder is much more reliable to fatigue,electro-migration, and also creates a much less stressful package dueto the decrease in collapse height during processing. Going with eutectic solder is only for cost reduction and only for small die size applications.
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[ 本帖最后由 自然韵律 于 2008-10-17 22:50 编辑 ]