[新闻] 任天堂新主机重磅泄露，如果是真的话，赢了！

掌机家用机合体双重泄露

家用机GPU代号雷帝，赢了！

FUSION DS

CPU: ARMv8-A Cortex-A53 GPU: Custom Adreno 420-based AMD GPU
COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
>2 130 mm DVGA (960 x 640) Capacitive Touchscreen
>Slide Out Design with Custom Swivel Tilt Hinge
>Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
>Low End Vibration for Gameplay and App Alerts
>2 Motorized Circle Pads for Haptic Feedback
>Thumbprint Security Scanner with Pulse Sensing Feedback
>2 1mp Stereoptic Cameras
>Multi-Array Microphone
>A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
>3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
>NFC Reader
>3G Chip with GPS Location
>Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
>16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigbytes)
>Nintendo 3DS Cart Slot
>SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
>Mini USB I/O
>3300 mAh Li-Ion battery

FUSION TERMINAL

GPGPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER
MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAME KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
>802.11 b/g/n Wireless
>Bluetooth v4.0 BLE
>2 USB 3.0
>1 Coaxial Cable Input
>1 CableCARD Slot
>4 Custom Stream-Interface Nodes up to 4 Wii U GamePads or 4 DSc
>Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot.
>1 HDMI 2.0 1080p/4K Port
>Dolby TrueHD 5.1 or 7.1 Surround Sound
>Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
>Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage.