小黑屋
原帖由 自然韵律 于 2008-10-17 22:38 发表 If you actually read academic studies and participate in engineering, you would know that high-lead solder is much more reliable to fatigue,electro-migration, and also creates a much less stressful package dueto the decrease in collapse height during processing. Going with eutectic solder is only for cost reduction and only for small die size applications.
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