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[新闻] AMD 踢爆三红秘密(AMD详解GPU封装缺陷问题起源)

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原帖由 自然韵律 于 2008-10-17 22:38 发表
If you actually read academic studies and participate in engineering, you would know that high-lead solder is much more reliable to fatigue,electro-migration, and also creates a much less stressful package dueto the decrease in collapse height during processing. Going with eutectic solder is only for cost reduction and only for small die size applications.
engineering major 的来证实一下这段呗


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