从国外网站上看到的，如下：
Semiconductor Insights has completed a full video teardown on the Nintendo Wii, and are analyzing some of the components inside, including the IBM "Broadway" processor, ATI "Hollywood" graphics processor, Broadcomm BCM2042 wireless sensor with Bluetooth functionality, Broadcomm BCM4318 WiFi transceiver, Qimonda HYB18HS1232 GDDR3, Samsung K9F4G08U0A 65nm 4Gbit NAND Flash, and Elpida S1616AGTA 16Mbit SDRAM.
